POLYIMIDE COATED METAL FOIL OF LOW RELATIVE ROUGHNESS AND METHOD FOR SURFACE PROCESSING METAL FOIL

Japanese Patent JP2006142834

A

To provide a polyimide metal foil preferred as a totally polyimide substrate material and a method for surface processing a metal foil, which solve the problem of conventional metal foil laminates for a substrate that the use of a metal foil of low surface roughness results in low adhesive strength.

The polyimide coated metal foil comprises a low surface roughness metal foil with Ra of 0.2μm or less, and a polyimide coating film of 0.1 to5μm thickness which is provided on the surface of the metal foil; wherein the coating film is obtained from 2,2-bis(4-aminophenoxyphenyl) propane and an aromatic tetracarboxylic dianhydride or its derivative (acid, acid-ester or half ester of the acid). The method for surface processing the low surface roughness metal foil comprises applying an organic solvent solution of polyamic acid to provide polyimide on the surface of the low surface roughness metal foil with Ra of 0.2μm or less so that the thickness of the polyimide coating film will be 0.1 to 5μm after heating.

WO/2007/123161	POLYIMIDE FILM FOR METALLIZING AND METAL LAMINATED POLYIMIDE FILM
JPS5698135	PREPARATION OF POLYMIDE RESIN LAMINATED PLATE WITH ONE COPPER
JP2007161811	ADHESIVE COMPOSITION FOR FLEXIBLE BASE BOARD AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME

YAMAMOTO TOMOHIKO
KATO KATSUZO
HOSOMA TOSHINORI
OKUNO TAKASHI
WATAKABE HIDEJI

JP2005358558A

June 08, 2006

December 13, 2005

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UBE INDUSTRIES

B32B15/088; B05D7/14; B05D7/24

JPH0379097A	1991-04-04
JPH11298114A	1999-10-29
JPH07193349A	1995-07-28
JP2000052483A	2000-02-22

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