POLYIMIDE COMPOSITE FLEXIBLE SHEET AND ITS MANUFACTURING METHOD

Japanese Patent JP2008114580

A

To provide a polyimide resin composite flexible sheet used for obtaining a polyimide composite flexible sheet, which is excellent in stickiness, mechanical properties, heat resistance and size stability, and having no warpage or bending problem, without using a pressure-sensitive adhesive, and its manufacturing method.

A polyamic acid of which the coefficient of thermal expansion (CTE) after cyclization is larger than 20 ppm and a polyamic acid of which the thermal expansion (CTE) after cyclization is smaller than 20 ppm are applied to the surface of a metal foil sequentially and the polyamic acids are subsequently cyclized by heating to form a polyimide. By this method, the polyimide resin composite soft sheet for a printed circuit board is manufactured.

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HWANG KUEN YUAN
TU AN PANG
WU SHENG YEN
LIN TE YU

JP2007111567A

May 22, 2008

April 20, 2007

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CHANG CHUN PLASTIC CO LTD

B32B15/088; C08G73/10

Seishiro Suzuki
Shinsuke Nakajima
Atsushi Tadokoro

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