To provide a polyimide/metal laminate that is excellent in peel strength between a metal layer and a polyimide layer even when using a metal foil capable of being micorprocessed and having a low roughness and that does not cause deformation even when a component and an element are mounted thereon under a high temperature/high pressure condition.
A polyimide composition comprises a polyimide and/or its precursor and an inorganic substance containing one or more kinds of elements selected from the group consisting of Al, Si, Ca, Ti, Mn, Fe, Cu, Zn, Y, Sn, Bi, Ti, Sb, Zr, Mg, Ba and P incorporated into the polyimide and/or its precursor in an amount of not less than 0.1 wt% to not more than 40 wt% based thereon wherein the primary particle of the inorganic substance has a median particle size of not less than 5 nm to not more than 200 nm. The polyimide/metal laminate is formed by laminating a metal foil on one surface or both surfaces of the polyimide wherein the polyimide layer may consist of a single-ply layer or multi-ply layers having the same or different compositions and at least the polyimide layer brought into contact with the metal comprises the polyimide having the above polyimide composition.
| JPH09123343 | LAMINATE |
| JP2022056058 | ELECTROMAGNETIC WAVE SHIELDING PANEL AND MANUFACTURING METHOD OF THE SAME |
NAKAZAWA OOKI
KAWAGUCHI MASAO
TANABE KENJI
