Title:
ポリイミドの電着用組成物及びそれを用いたパターン化ポリイミド膜の作製方法
Document Type and Number:
Japanese Patent JP4958355
Kind Code:
B2
Abstract:
A composition for electro-depositing polyimide membranes which can be patterned by photolithography, which are excellent in heat resistance, insulation performance and in chemical resistance. The composition for electrodeposition of polyimides according to the present invention comprises a composition for electrodeposition of polyimides comprising a photoacid generator, a positive-type photosensitive polyimide having oxycarbonyl groups in side chains, a polar solvent which dissolves said polyimide, water, a dispersing agent, and an alkaline neutralizer.
Inventors:
Hiroshi Itaya
Shunichi Matsumoto
Shunichi Matsumoto
Application Number:
JP2001515761A
Publication Date:
June 20, 2012
Filing Date:
August 07, 2000
Export Citation:
Assignee:
PI Technology Research Institute Co., Ltd.
International Classes:
C09D179/08; C09D5/44; G03F7/004; G03F7/037; G03F7/038; G03F7/039; G03F7/16; G03F7/32
Domestic Patent References:
| JPH09104839A | 1997-04-22 | |||
| JPH03100076A | 1991-04-25 | |||
| JPH03209478A | 1991-09-12 | |||
| JPH11202488A | 1999-07-30 |
Foreign References:
| WO1999019771A1 | 1999-04-22 |
Attorney, Agent or Firm:
Eijiro Tanikawa