To provide a polyimide film excellent in adhesivity, handleability, flexibility, dimensional stability and heat resistance.
The polyimide film is characterized by being obtained from a precursor consisting of a polyamic acid synthesized from an aromatic diamine component comprising 0.1-10 mol% of carboxy-4,4'-diaminodiphenylmethane, 10-30 mol% of p-phenylenediamine and 60-89.9 mol% of 4,4'-diaminodiphenyl ether and an aromatic tetracarboxylic acid dianhydride component comprising 10-50 mol% of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and 50-90 mol% of pyromellitic dianhydride or a derivative of the aromatic tetracarboxylic acid dianhydride component. This polyimide film is such that its peel strength, Young's modulus, coefficient of linear expansion, water absorption and glass transition temperature are controlled within specific ranges, respectively.
| JP2006321229A | 2006-11-30 | |||
| JP2007039528A | 2007-02-15 | |||
| JP2006321981A | 2006-11-30 | |||
| JPS60210629A | 1985-10-23 | |||
| JP2006176581A | 2006-07-06 | |||
| JP2003335874A | 2003-11-28 |
Takanobu Takekawa
High Shinichi Ara
Tsutomu Nishio
Hideaki Kamiya