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Title:
POLYIMIDE FILM AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2007277494
Kind Code:
A
Abstract:

To provide a polyimide film having a high tensile modulus, the surface of which is simultaneously finely roughed and uniformly roughed.

The polyimide film has a tensile modulus of 2 GPa or more, an Ra (average surface roughness) of 5-150 nm, and an Ra/σ [(average surface roughness)/(standard deviation of average surface roughness)] of 2-5,000 and is particularly from a polyimide in which the residue of an aromatic diamine has a diamine residue having a benzoxazole skeleton. A method for manufacturing the surface roughed polyimide film comprises subjecting at least one surface of a polyamide film to wet blasting treatment by directing a jet of a particle-containing slurry at the film surface.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
YOSHIDA TAKESHI
OKUYAMA TETSUO
TSUCHIYA TOSHIYUKI
MAEDA SATOSHI
Application Number:
JP2006109437A
Publication Date:
October 25, 2007
Filing Date:
April 12, 2006
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C08J5/18; B32B15/088