Title:
ポリイミドフィルムとその製造方法、積層体の製造方法
Document Type and Number:
Japanese Patent JP5742725
Kind Code:
B2
Inventors:
Tetsuo Okuyama
Hidenori Sugihara
Masahiro Tamada
Toshiyuki Tsuchiya
Goji Maeda
Hidenori Sugihara
Masahiro Tamada
Toshiyuki Tsuchiya
Goji Maeda
Application Number:
JP2011548445A
Publication Date:
July 01, 2015
Filing Date:
October 11, 2011
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
C08J7/00; B29C65/02; B32B27/20; B32B27/34; C08J5/18
Domestic Patent References:
| JP2004051972A | 2004-02-19 | |||
| JPH08259714A | 1996-10-08 | |||
| JPH08150687A | 1996-06-11 | |||
| JPH06313055A | 1994-11-08 |
Foreign References:
| WO2006093272A1 | 2006-09-08 |