Title:
POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2016132744
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide film capable of reducing a dimension change in a width direction (TD) of a film, and favorable for a substrate for a fine pitch circuit such as a chip-on-film (COF) using a semi-additive method.SOLUTION: The polyimide film is constituted by paraphenylenediamine, pyromellitic acid dianhydride, and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride used as principal raw materials where protrusions of a surface of the polyimide film is formed of inorganic particles having an average particle size of 0.01-1 μm, the heat expansion coefficient αof the film in a machine-conveying direction (MD) measured under the condition of a measuring range of 50-200°C and a temperature-raising rate of 10°C/min. is within a range of 2.0-10.0 ppm/°C, the heat expansion coefficient αof TD is within a range of 2.0-3.5 ppm/°C, and the relation |α|≥|α|×2.0 is satisfied.SELECTED DRAWING: None
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Inventors:
YATSUNAMI YUJI
YASUDA MASABUMI
OGURA MIKIHIRO
YASUDA MASABUMI
OGURA MIKIHIRO
Application Number:
JP2015009313A
Publication Date:
July 25, 2016
Filing Date:
January 21, 2015
Export Citation:
Assignee:
DU PONT-TORAY CO LTD
International Classes:
C08J5/18; B32B15/088; C08G73/10; H01L21/60; H05K1/03
Attorney, Agent or Firm:
Ryu Iwatani