Title:
Polyimide film
Document Type and Number:
Japanese Patent JP6034662
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide film in which generation of warpage is suppressed and twisting is reduced, used for an adhesive film for semiconductor assembly.SOLUTION: A polyimide film is characterized in that a film production width is 1 m or more, that an Anisotropy Index (AI) represented by a formula 1 in the case where a propagation velocity V of an ultrasonic pulse at film orientation angles (θ) of 45° and 135° with respect to a film machine conveying direction (MD) is measured, is 15 or less over the full width, and that a linear expansion coefficient in the machine conveying direction (MD) and a width direction (TD) is within a range of 10.0 ppm/°C or more and 25.0 ppm/°C or less, and the polyimide film is used for an adhesive film for semiconductor assembly, wherein the formula 1 is AI(45, 135)=|(V45^2-V135^2)/((V45^2+V135^2)/2)×100|.
Inventors:
Noriko Toida
Sawasaki Koichi
Sawasaki Koichi
Application Number:
JP2012241114A
Publication Date:
November 30, 2016
Filing Date:
October 31, 2012
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01L23/48; B32B27/34; C08G73/10; C08J5/18; C08J7/04; C09J7/02; C09J179/08; C09J201/00; H01L21/52
Domestic Patent References:
| JP2003165850A | ||||
| JP5237928A | ||||
| JP2011063775A | ||||
| JP2003188334A | ||||
| JP2011124495A | ||||
| JP2011131591A | ||||
| JP2011068867A | ||||
| JP2007123711A | ||||
| JP2006229139A |
Attorney, Agent or Firm:
Ryu Iwatani