Title:
POLYIMIDE AND LAMINATED MATERIAL
Document Type and Number:
Japanese Patent JP3912183
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide having high heat resistance and transparency, and in addition, capable of peeling off resin layers by a solvent giving a small load to the environment such as a dilute aqueous inorganic alkaline solution.
SOLUTION: This polyimide is obtained by reacting at least 1 kind of the compound selected from diamines with at least 1 kind of the compound selected from acid di-anhydrides in an organic solvent, and as an essential component of the diamine, an aliphatic ring-structured diamine having ≥1 carboxy group is supplied for the reaction.
Inventors:
Hosokawa Katsumoto
Seiji Kamimura
Honda Yuki
Yoshiyuki Ando
Kenji Asano
Yuzo Ito
Seiji Kamimura
Honda Yuki
Yoshiyuki Ando
Kenji Asano
Yuzo Ito
Application Number:
JP2002150348A
Publication Date:
May 09, 2007
Filing Date:
May 24, 2002
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
B32B27/34; C08G73/10; (IPC1-7): C08G73/10; B32B27/34
Domestic Patent References:
| JP2000034348A | ||||
| JP11038620A |
Foreign References:
| WO2001025313A1 |
Attorney, Agent or Firm:
Hiroshi Okikawa