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Patent Searching and Data


Title:
POLYIMIDE MOLDING, ITS MANUFACTURING AND USE APPLICATION
Document Type and Number:
Japanese Patent JPH1058628
Kind Code:
A
Abstract:

To maintain superior adhesion properties, sputtering and metal vapor deposition properties while retaining the characteristics of an arbitrarily selected aromatic polyimide molding by laminating a thin layer of amorphous polyimide on part of a crystalline polyimide molding.

This polyimide molding is obtained by high temperature heating process. That is, it is a multilayer polyimide molding consisting of a crystalline polyimide molding whose crystallinity is measured by an X-ray diffractometry and a thin layer of amorphous polyimide laminated at least, on part of the crystalline polyimide molding. The crystalline polyimide is preferably of the crystallinity of 5% or more as measured by the X-ray diffractometry and sought by the Rowland method. Especially, the crystalline polyimide with the crystallinity of about 10% or more, especially, about 15% or more which is manufactured of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and 1,4- diaminobenzene is the best suited crystalline polyimide from the viewpoint of the thermal properties of a multilayer polyimide molding.


Inventors:
YAMAGUCHI HIROAKI
Application Number:
JP14205097A
Publication Date:
March 03, 1998
Filing Date:
May 30, 1997
Export Citation:
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Assignee:
UBE INDUSTRIES
International Classes:
C08J5/00; B32B15/08; B32B15/088; B32B27/34; C08G73/10; (IPC1-7): B32B27/34; B32B15/08; C08G73/10; C08J5/00