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Patent Searching and Data


Title:
POLYIMIDE POROUS FILM COMPOSITE MATERIAL AND PROTON CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2008056934
Kind Code:
A
Abstract:

To provide a new material exhibiting a new function by using a polyimide film having excellent heat resistance, chemical resistance and mechanical strength as a base material; and to provide a proton conductive film having heat resistance and proton conductive properties by using the polyimide film as a base material.

The polyimide porous film composite material is obtained by filling the pores of a polyimide porous film with a highly heat-resistant organic material and/or an inorganic material to keep the shape by the physical and/or chemical interaction. The proton conductive film is obtained by filling the pores of the polyimide porous film with a monomer or macromonomer becoming a precursor of a polymer having high heat resistance and proton-conductive properties, and inducing a chemical reaction such as macromolecularization and crosslinking to form the polymer.


Inventors:
OYA NOBUO
YAO SHIGERU
KIUCHI MASAYUKI
HIRANO TETSUHARU
Application Number:
JP2007241775A
Publication Date:
March 13, 2008
Filing Date:
September 19, 2007
Export Citation:
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Assignee:
UBE INDUSTRIES
International Classes:
C08J9/40; C08J5/22; H01B1/06; H01M8/02; H01M8/10