Title:
POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM PRODUCED USING THE SAME
Document Type and Number:
Japanese Patent JP2023118122
Kind Code:
A
Abstract:
To provide a polyimide precursor composition which allows the production of a polyimide film capable of alleviating thermal expansion-contraction behavior.SOLUTION: A polyimide precursor composition according to one embodiment of the present invention includes a polyimide precursor including a siloxane structure and a solvent having a negative partition coefficient (log P). Such a polyimide precursor composition is used to alleviate thermal expansion-contraction behavior, allowing the production of a polyimide film with minimal curling.SELECTED DRAWING: None
Inventors:
YUN CHEOL MIN
KIM JUNG HO
PARK HYE JIN
LEE CHANG Q
KIM JUNG HO
PARK HYE JIN
LEE CHANG Q
Application Number:
JP2023020367A
Publication Date:
August 24, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
SK INNOVATION CO LTD
International Classes:
C08G73/10; B05D7/24; B32B17/10; B32B27/34; C08J5/18; C08K5/00; C08L79/08; C09D7/20; C09D179/08
Attorney, Agent or Firm:
Masayuki Shobayashi
Kazuyoshi Hayashi
Kazuyoshi Hayashi