Title:
POLYIMIDE PRECURSOR FILM AND METHOD FOR PRODUCING POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2003292643
Kind Code:
A
Abstract:
To provide a polyimide precursor film for producing a polyimide film which has a high degree of mechanical properties and thermal dimensional stability, and a poly(p-phenylene-pyromellitimide) as the major component, and a method for producing the polyimide film by using the polyimide precursor film.
The polyimide precursor film is obtained by subjecting a gel polyimide precursor film which is obtained by casting a polyamic acid solution of the poly(p-phenylene-pyromellitimide) and contains a dehydrating condensing agent and a ring-opening catalyst, and treating the cast polyamic acid solution at a low temperature to heat treatment, and the method for producing the polyimide film uses this polyimide precursor film.
Inventors:
HONDA SUSUMU
NAKAMURA TSUTOMU
ISHIWATARI TOYOAKI
SADANOBU JIROU
NAKAMURA TSUTOMU
ISHIWATARI TOYOAKI
SADANOBU JIROU
Application Number:
JP2002101023A
Publication Date:
October 15, 2003
Filing Date:
April 03, 2002
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
C08J5/18; B29C41/24; C08G73/10; B29K79/00; B29L7/00; (IPC1-7): C08J5/18; B29C41/24; C08G73/10
Attorney, Agent or Firm:
Hideko Mihara