Title:
POLYIMIDE RESIN, RESIN COMPOSITION CONTAINING THE POLYIMIDE RESIN AND CURED PRODUCT OF THE SAME
Document Type and Number:
Japanese Patent JP2023076131
Kind Code:
A
Abstract:
To provide a resin material which is suitably usable for a printed wiring board and has a new structure, and a resin composition which contains the resin material, is excellent in a coating property to a base material, and provides a cured product that is excellent in adhesion to a metallic foil having low roughness and a base material, mechanical characteristics, heat resistance and dielectric characteristics.SOLUTION: A polyimide resin is a copolymer of an amino compound (A) containing a linear aliphatic diamino compound (a1) which has amino groups at both terminals and 1 to 4 methyl groups and/or ethyl groups at a side chain, and has a 17-24C main chain and an aromatic diamino compound (a2), and a tetrabasic acid dianhydride (B).SELECTED DRAWING: None
Inventors:
NISHIMURA KENGO
TANAKA RYUTARO
YAMAMOTO KAZUYOSHI
SASAKI TOMOE
NAGASHIMA NORIYUKI
TANAKA RYUTARO
YAMAMOTO KAZUYOSHI
SASAKI TOMOE
NAGASHIMA NORIYUKI
Application Number:
JP2021189349A
Publication Date:
June 01, 2023
Filing Date:
November 22, 2021
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G73/10; C08L79/08
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