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Patent Searching and Data


Title:
POLYIMIDE RESIN COMPOSITION, POLYIMIDE FILM, POLYIMIDE TUBULAR MATERIAL AND ELECTROPHOTOGRAPHIC TUBULAR MATERIAL
Document Type and Number:
Japanese Patent JP2003113306
Kind Code:
A
Abstract:

To provide a transparent or nonblack polyimide resin composition having a stable medium resistivity value at normal temperature and humidity to high temperature and humidity with slight fluctuation of the resistivity values due to variation between samples, a change in amount added and a change in voltage and environment, excellent mechanical characteristics and excellent antistatic properties by transportation, transferability and fixing properties in an electrophotographic machine and easily cleaning a toner sticking by misprints in a transfer belt or a fixing belt, etc.

This polyimide resin composition comprises 100 pts.wt. of a polyimide resin and 5-200 pts.wt. of potassium titanate and/or aluminum borate. The polyimide resin composition has a volume resistivity value within the range of 1×109 to 1×1015 Ωcm.


Inventors:
NISHIKAWA TAIJI
KANESHIRO NAGAYASU
NOJIRI HITOSHI
SEZAKI KOJI
Application Number:
JP2001309449A
Publication Date:
April 18, 2003
Filing Date:
October 05, 2001
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
G03G15/16; B65H5/02; C08J5/00; C08K3/04; C08K3/08; C08K3/24; C08K3/38; C08L79/08; G03G15/00; G03G15/20; (IPC1-7): C08L79/08; B65H5/02; C08J5/00; C08K3/04; C08K3/08; C08K3/24; C08K3/38; G03G15/00; G03G15/16; G03G15/20