Title:
ポリイミド樹脂組成物及び金属ポリイミド積層体
Document Type and Number:
Japanese Patent JP4987733
Kind Code:
B2
Inventors:
Matsuura Koya
Application Number:
JP2007554893A
Publication Date:
July 25, 2012
Filing Date:
January 16, 2007
Export Citation:
Assignee:
Asahi Kasei E-materials Co., Ltd.
International Classes:
C09J179/08; B32B15/08; B32B15/088; C09J161/24; C09J161/28
Domestic Patent References:
JP2003298227A | 2003-10-17 | |||
JP2005072454A | 2005-03-17 | |||
JPH02120383A | 1990-05-08 | |||
JPH05125345A | 1993-05-21 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki