Title:
POLYIMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYIMIDE FILM AND POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2020158666
Kind Code:
A
Abstract:
To provide a polyimide film capable of forming a film at a low cost and having a small birefringence, a small birefringence unevenness and a small film thickness.SOLUTION: There is provide a polyimide resin composition comprising a soluble polyimide resin and a solvent, wherein the solvent includes a high boiling point solvent having a boiling point under atmospheric pressure of 150°C or more and a low boiling point solvent having a boiling point under atmospheric pressure of less than 100°C, the content of a high boiling point solvent in the solvent is 0.1 wt.% or more and 50 wt.% or less. As the high boiling point solvent, an amide-based solvent or an ester-based solvent is preferable.SELECTED DRAWING: None
Inventors:
TAGUCHI YUSUKE
KATAYAMA KEISUKE
KOMATSU SATOKO
KONDO YASUTAKA
MIYAMOTO MASAHIRO
KATAYAMA KEISUKE
KOMATSU SATOKO
KONDO YASUTAKA
MIYAMOTO MASAHIRO
Application Number:
JP2019060631A
Publication Date:
October 01, 2020
Filing Date:
March 27, 2019
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L79/08; C08J5/18
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