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Title:
ポリイミド樹脂組成物、ポリイミド樹脂組成物の製造方法、透明基板及びディスプレイ用フィルム
Document Type and Number:
Japanese Patent JP6915251
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide resin composition which is excellent in mechanical characteristics and suppresses coloration peculiar to polyimide.SOLUTION: The present invention provides a polyimide resin composition containing polyimide. The composition contains polyimide which has a solubility at 25°C to dichloromethane (100 mass%) or 1,3-dioxolane (100 mass%) in a range of 0.01-10 mass% and has an aromatic moiety, and a compound A which has a partial structure having an NICS value in a range of -15.0 to -7.0 and has a molecular weight in a range of 250-10,000.SELECTED DRAWING: None

Inventors:
Horie Yutaro
Kazushige Nakahara
Kiyoshi Fukusaka
Yasutoshi Ito
Application Number:
JP2016192617A
Publication Date:
August 04, 2021
Filing Date:
September 30, 2016
Export Citation:
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Assignee:
Konica Minolta Co., Ltd.
International Classes:
C08L79/08; C08G73/10; C08K5/00; G02F1/1333; G09F9/30
Domestic Patent References:
JP8100122A
JP2017203984A
JP7179840A
JP2006299009A
JP2012162619A
JP2001040192A
Foreign References:
WO2014109350A1
WO2016152459A1
Attorney, Agent or Firm:
Gwangyang International Patent Office