Title:
POLYIMIDE RESIN COMPOSITION, AND SEAL RING
Document Type and Number:
Japanese Patent JP2018162411
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that possesses a specific flexural modulus, and is excellent in slidability with a soft metal as a counterpart material (for example, aluminum, copper, zinc or the like) as well as excellent in the wear resistance of the resin composition itself.SOLUTION: A polyimide resin composition contains a thermoplastic polyimide resin 50 pts.mass-98 pts.mass, a phenolic resin carbon fiber 1 pt.mass-40 pts.mass, and a fluorine resin 1 pt.mass-10 pts.mass and has a flexural modulus of 3000 MPa-7000 MPa.SELECTED DRAWING: None
Inventors:
SATO TOMOAKI
SANO KOICHI
SANO KOICHI
Application Number:
JP2017061309A
Publication Date:
October 18, 2018
Filing Date:
March 27, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L79/08; C08K7/06; C08L27/12; F16J9/28
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda
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