POLYIMIDE RESIN COMPOSITION - AMT KENKYUSHO KK

Title:

POLYIMIDE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2006335789

Kind Code:

A

Abstract:

To provide a polyimide resin composition having excellent processability, adhesiveness and heat resistance.

The polyimide resin composition comprises a polyimide obtained by polymerizing an acid component with a diamine component and an isoimide oligomer represented by general formula (2) (wherein, i is a number of 0-20; Ar3 is a tetracarboxylic acid residue; Ar4 is a diamine residue; Ar5 is a dicarboxylic acid residue; and R is a hydrogen or a 1-24C organic group). The isoimide oligomer has triple bonds at the molecular terminals.

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Inventors:

WATANABE TAKASHI
NAKAJIMA KENJI
NANBA SATORU

Application Number:

JP2005158649A

Publication Date:

December 14, 2006

Filing Date:

May 31, 2005

Export Citation:

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Assignee:

AMT KENKYUSHO KK
MANAC INC

International Classes:

C08L79/08; C08G73/10; C08J5/24; C08K5/29; C09J149/00; C09J179/08; H05K3/46

Domestic Patent References:

JPH0693117A

1994-04-05

Attorney, Agent or Firm:

Hajime Tsukuni
Fumio Shinoda

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