Title:
ポリイミド樹脂、ポリイミド樹脂組成物、それを用いた被膜形成材料、および電子部品
Document Type and Number:
Japanese Patent JP4534117
Kind Code:
B2
Inventors:
Tomohiro Hirata
Application Number:
JP2003197090A
Publication Date:
September 01, 2010
Filing Date:
July 15, 2003
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G73/10; C08L79/08; C08G18/77; C08L63/00; C09D163/00; C09D179/08
Domestic Patent References:
| JP2003198105A | ||||
| JP2002145981A | ||||
| JP2005002192A | ||||
| JP2003335944A | ||||
| JP57177050A | ||||
| JP11199669A |