Title:
POLYIMIDE RESIN PRECURSOR, INSULATING COATING MATERIAL, VARNISH, METAL PROTECTIVE FILM, AND METHOD FOR PRODUCING POLYIMIDE RESIN PRECURSOR
Document Type and Number:
Japanese Patent JP2023146193
Kind Code:
A
Abstract:
To provide a polyimide resin precursor which has high solubility to a ketone-based solvent having no problem of carcinogenicity and toxicity to reproduction, instead of an amide-based solvent such as N-methyl-2-pyrrolidone which is generally used as a solvent of a polyimide resin and may have high carcinogenicity and toxicity to reproduction.SOLUTION: A polyimide resin precursor is obtained by mixing and heating a tetracarboxylic acid dianhydride and diamine in the absence of a solvent, wherein the mol number of the diamine in the raw material to be mixed and heated is larger than the mol number of the tetracarboxylic acid dianhydride.SELECTED DRAWING: None
Inventors:
KIKUCHI SHIGENOBU
MATSUDA JUNA
KATO TAKESHI
MATSUDA JUNA
KATO TAKESHI
Application Number:
JP2022053261A
Publication Date:
October 12, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
PURINTEKKU KK
International Classes:
C08G73/10; C09D7/63; C09D179/04
Attorney, Agent or Firm:
Katsuyuki Ohkubo
Ichiro Kaneko
Ichiro Kaneko
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