Title:
POLYIMIDE SILICON RESIN PRECURSOR COMPOSITION
Document Type and Number:
Japanese Patent JP2764674
Kind Code:
B2
Abstract:
PURPOSE: To provide the subject composition containing a specific polysiloxane component and a specific polyamic acid component, etc., curable in a short time at a low temperature, having excellent solvent resistance, heat-resistance and adhesion and suitable as an insulation film for electronic part, etc.
CONSTITUTION: The objective composition contains (A) a polysiloxane component having the constituent unit of formula I (R is 1-10C univalent organic group; R1 is H or 1-10C univalent organic group; (m) is ≥3) and (B) a polyamic acid component of formula II (X is tetravalent organic group; Y is bivalent organic group; (n) is ≥1) or a polyimide resin component produced by the thermal dehydrative cyclization of the polyamic acid. The weight ratio of the component B to the component A is preferably (3-50) to 1. A polyimide silicone resin is produced by curing the composition.
More Like This:
Inventors:
OKINOSHIMA HIROSHIGE
KATO HIDETO
TOYODA SATOSHI
KATO HIDETO
TOYODA SATOSHI
Application Number:
JP8922593A
Publication Date:
June 11, 1998
Filing Date:
March 24, 1993
Export Citation:
Assignee:
SHINETSU KAGAKU KOGYO KK
International Classes:
C08G73/10; C08G77/14; C08G77/388; C08G77/455; C08L79/08; C08L83/04; C08L83/06; C08L83/08; (IPC1-7): C08L83/06; C08G73/10; C08G77/14; C08G77/388; C08L79/08; C08L83/08
Attorney, Agent or Firm:
Shuji Iwamiya