Title:
POLYIMIDE SILOXANE COMPOSITION
Document Type and Number:
Japanese Patent JP3243963
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition, comprising a specific polyimide siloxane and an epoxy resin, excellent in heat and solder flux resistances, adhesion and storage stability and suitable as a printing ink, a coating varnish, etc., capable of forming a protecting film on a flexible wiring board.
CONSTITUTION: This composition comprises (A) 100 pts.wt. polyimide siloxane, having a structure of formula I [R1 is a tetravalent residue after removing a carboxylic acid from an aromatic tetracarboxylic acid; R2 is a bivalent residue (Z1) after removing NH2 from a compound of formula II [R5 is a bivalent hydrocarbon group, etc.; R6 is a 1-3C alkyl, etc.; n1 is 3-30], a bivalent residue (Z2) after removing NH3 from a compound of formula III (X is a direct bond, O, etc.; γ1 is OH, etc.; n2 is 1 or 2; n3 is 0-3) and a bivalent residue (Z3) after removing NH2 from other diamines; m1 is the number of structural units] in which m1, m2 and m3 are each the number of structural units containg Z1, Z2 and Z3 and (B) 1-50 pts.wt. epoxy resin. The component (A) is soluble in organic solvents and has ≥0.16 inherent viscosity. The respective ratios of m1, m2 and m3 in which R2 is Z1, Z2 and Z3 in the polymer are 45-80mol%, 0.5-40mol% and the balance based on 100mol% sum total.
Inventors:
Seiji Ishikawa
Masayuki Nakatani
Hiroyuki Fukuda
Shigeru Yamamoto
Masayuki Nakatani
Hiroyuki Fukuda
Shigeru Yamamoto
Application Number:
JP5904495A
Publication Date:
January 07, 2002
Filing Date:
March 17, 1995
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C08L63/00; C08G73/10; C08L79/08; H05K3/28; (IPC1-7): C08L79/08; C08L63/00
Domestic Patent References:
| JP436321A | ||||
| JP6157875A |