Title:
POLYIMIDE SILOXANE FILM OF LOW THERMAL CONDUCTIVITY
Document Type and Number:
Japanese Patent JP3395269
Kind Code:
B2
Abstract:
PURPOSE: To obtain the film, composed of a cross-linkable copolymer having specific three kinds of recurring units, having high hardness and heat resistance, excellent in adhesion to substrates and low thermal conductivity and useful as a heat insulating material, etc.
CONSTITUTION: This film is composed of a cross-linkable copolymer having three kinds of recurring units expressed by formulas I, II and III [R1 is a tetravalent organic group; R2 is a 2-30C bivalent organic group; R3 is a group expressed by formulas IV, V, etc.; R4 and R5 are a 1-7C organic group; (n) is ≥0 and ≤50; (p), (q) and (r) are positive integers and values within the range satisfying the formulas VI, etc.].
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Inventors:
Kouichi Kunimune
Toshiharu Aono
Toshiharu Aono
Application Number:
JP19907293A
Publication Date:
April 07, 2003
Filing Date:
July 16, 1993
Export Citation:
Assignee:
Chisso Corporation
International Classes:
C08G73/10; C08G77/42; C08G77/455; C08J5/18; C09D183/04; C09J179/08; (IPC1-7): C08G73/10; C08G77/455; C08J5/18; C09J179/08
Domestic Patent References:
| JP1126335A |
Attorney, Agent or Firm:
Chika Takagi (2 outside)