Title:
POLYIMIDE SYSTEM ADHESIVE
Document Type and Number:
Japanese Patent JP2021161285
Kind Code:
A
Abstract:
To provide a polyimide system adhesive capable of contributing to high-speed transmission and low loss required in 5G communication system, by providing low dielectric property and copper foil adhesiveness in combination, by utilizing characteristics of the polyimide having high heat resistance and high strength.MEANS FOR SOLVING THE PROBLEM: As a result of the eager examination, when the polyamic acid corresponding to the polyimide precursor is polymerized, the total molar amount of the diamine compound is made to be excessive with respect to the total molar amount of the acid anhydride, the end structure of the obtained polyamic acid is made as an amino group derived from the diamine compound. As the result, it has been found that the adhesion strength is higher than the carboxylic acid residue derived from acid anhydride. In addition, it has been found that by optimizing the amount of fluorine atom in the polyamic acid, it is possible to have dielectric property and copper foil adhesion.SELECTED DRAWING: None
Inventors:
MIYAMOTO TAKESHI
Application Number:
JP2020065213A
Publication Date:
October 11, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
OSAKA SODA CO LTD
International Classes:
C09J179/08; C09J163/00