To obtain the subject composition capable of presenting a polymer material having a low dielectric constant and excellent in heat resistance and adhering properties by bringing the composition to contain a polymer constituted of a specific organic group and a specific group.

This polymer composition having a low dielectric constant is brought to contain a polymer constituted of 5-35 mole % of (A) a 3-4 valent 3-30C organic group and one or more of groups selected from (B) formula I [Q1 and Q3 are each a 3-4 valent organic group having >2C; Q2 is a divalent organic group having >2C; Q4 and Q5 are each H, a monovalent organic group having 1-10C; (p) is 1-100; (q) and (r) are each 1 or 2], formula II [Q6 and Q8 are each a tetravalent organic group having >2C; Q7 is a divalent organic group having >2C; (s) is 0-100], formula III [Q9 and Q11 are each a tetravalent organic group having >2C; Q10 is a divalent organic group having >2C; (t) is 0-100], formula IV [Q12 and Q14 are each a 2-4 valent organic group having >2C; Q13 is a 3-6 valent organic group having >2C; Z is O, S or NH; (u) is 1-100; (v) and (w) are each 1 or 2], formula V [Q15 and Q17 are each a divalent and >2C organic group; Q16 is a tetravalent and >2C organic group (x) is 0-100], etc.