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Title:
POLYMER COMPOUND, CHEMICALLY AMPLIFIED RESIST MATERIAL AND METHOD FOR PATTERNING
Document Type and Number:
Japanese Patent JP3897088
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a new polymer compound useful as a base polymer for chemically amplified resist material with excellent transmittance to vacuum UV rays, to obtain a chemically amplified resist material comprising the polymer compound, and to provide a method for patterning using the resist material.
SOLUTION: This polymer compound has a group expressed by the general formula (1) (where R1 and R2 each represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1 to 20 carbons or a fluorized alkyl group, provided that at least one of R1 and R2 contains a fluorine, and R represents a cyclic alkyl group formed from at least a ring having 3 to 20 carbons). This resist material senses high energy beam, having excellent sensitivity to a wavelength below 200 nm, especially below 170 nm, having improved plasma etching resistance together with excellent resolvability due to introduction of a cyclic alkyl group into the ester side chain.


Inventors:
Yuji Harada
Jun Watanabe
Jun Hatakeyama
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Mitsutaka Otani
Satoru Miyazawa
Kentaro Tsutsumi
Kazuhiko Maeda
Application Number:
JP2000383217A
Publication Date:
March 22, 2007
Filing Date:
December 18, 2000
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
International Classes:
G03F7/039; C08F20/16; C08F20/22; C08F22/18; C08F22/40; C08F32/08; C08K5/00; C08L33/06; C08L35/02; H01L21/027; (IPC1-7): C08F20/16; C08F22/18; C08F22/40; C08F32/08; C08K5/00; C08L33/06; C08L35/02; G03F7/039; H01L21/027
Domestic Patent References:
JP2202904A
JP2002006501A
JP2001302726A
JP2002012623A
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa