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Title:
POLYMER COMPOUND FOR PHOTORESIST AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002338627
Kind Code:
A
Abstract:

To obtain a polymer compound which exhibits a high etching resistance when used for a photoresist.

This polymer compound contains at least one kind of monomer unit selected from monomer units represented by formulas (Ia)-(Ig) [wherein Ra is H or methyl; R1 and R2 are each H or a 1-5C hydrocarbon group; R3 is an optionally substituted tertiary hydrocarbon group; R4 is H, a 1-20C hydrocarbon group, hydroxyl, etc.; A is a single bond, methylene, ethylene, etc.; L is an optionally substituted 5-membered or higher lactone ring; X is an optionally substituted divalent alicyclic group; Y, Y1, and Y2 are each an optionally substituted monovalent alicyclic group (with the proviso that n is 0, then Y in formula (Ic) excludes an optionally substituted adamantyl group); m is 0 or 1; and n, n1, and n2 are each 0, 1 or 2].


Inventors:
TSUTSUMI KIYOHARU
INOUE KEIZO
FUNAKI KATSUNORI
NAKANO TATSUYA
HORAI AKIRA
Application Number:
JP2001153173A
Publication Date:
November 27, 2002
Filing Date:
May 22, 2001
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
G03F7/039; C08F20/18; C08F20/28; C08F220/18; C08F220/28; C08F222/06; C08F232/08; H01L21/027; (IPC1-7): C08F20/28; C08F20/18; C08F220/18; C08F220/28; C08F222/06; C08F232/08; G03F7/039; H01L21/027
Domestic Patent References:
JPH10312060A1998-11-24
JP2002372784A2002-12-26
JPH06322180A1994-11-22
Attorney, Agent or Firm:
Yukihisa Goto



 
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