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Title:
POLYMER COMPOUND, POSITIVE RESIST MATERIAL, AND METHOD FOR FORMING PATTERN USING THE MATERIAL
Document Type and Number:
Japanese Patent JP2004149756
Kind Code:
A
Abstract:

To obtain a positive resist material, especially a chemically amplified positive resist material, having a high sensitivity, a high resolution, an exposure latitude, process adaptability which are superior to those of a conventional positive resist material, gives good-shaped pattern after exposure, and is small in, especially, line edge roughness, and is excellent in etching resistance.

The polymer compound consists essentially of repeating units represented by formula (1) or formula (2) and has a weight-average molecular weight in the range of 1,000 to 500,000. The positive resist material contains the polymer compound as a base resin.


Inventors:
HATAKEYAMA JUN
KANOU TAKESHI
HASEGAWA KOJI
WATANABE TAKESHI
WATANABE OSAMU
TAKEDA TAKANOBU
Application Number:
JP2003061069A
Publication Date:
May 27, 2004
Filing Date:
March 07, 2003
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
G03F7/039; C08F232/08; H01L21/027; (IPC1-7): C08F232/08; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Mikio Yoshimiya