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Title:
POLYMER COMPOUND, POSITIVE-TYPE RESIST MATERIAL AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2004115630
Kind Code:
A
Abstract:

To provide a positive-type resist material, particularly a chemically-amplified, positive-type resist material, having a high resolution, margin of exposure, a small difference between sparse and dense dimensions, and process adaptability, surpassing those of conventional positive-type resist materials, furnishing a good pattern shape on exposure, and showing excellent etching resistance.

A polymer compound having at least a repeating unit for copolymerization represented by general formula (1), and having a weight-average molecular weight of 1,000-500,000 is formulated as a base resin into the positive-type resist material.


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Inventors:
HATAKEYAMA JUN
KUSAKI WATARU
TAKEDA TAKANOBU
WATANABE OSAMU
Application Number:
JP2002279854A
Publication Date:
April 15, 2004
Filing Date:
September 25, 2002
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
G03F7/039; C08F212/14; C08F232/08; C08F234/02; C08F234/04; H01L21/027; (IPC1-7): C08F232/08; C08F212/14; C08F234/02; C08F234/04; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Mikio Yoshimiya



 
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