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Title:
POLYMER COMPOUND, RESIST COMPOSITION CONTAINING THE POLYMER COMPOUND AND DISSOLUTION CONTROLLER
Document Type and Number:
Japanese Patent JP2004182796
Kind Code:
A
Abstract:

To obtain a polymer compound which is useful in a photoresist composition for fine processing of next generation, a resist composition using the polymer compound as a base polymer and a dissolution controller composed of the polymer compound.

The polymer compound contains an alicyclic group at the side-chain part so as to secure etching resistance and secures transparency of ≤3.0 μm-1 absorption coefficient to light with 157 wavelength by highly fluorinating hydrogen atoms on the ring of the alicyclic group. The alicyclic group is preferably a polycyclic alicyclic group, the high substitution with fluorine is desirably substitution of the whole hydrogen atoms on the ring and namely, the alicyclic group is a perfluoroalicyclic group. The resist composition is composed of the polymer compound as a base polymer. The dissolution controller is composed of the polymer compound.


Inventors:
OGATA TOSHIYUKI
ENDO KOTARO
TSUJI HIROMITSU
YOSHIDA MASAAKI
HANEDA HIDEO
TAKASU RYOICHI
SATO MITSURU
Application Number:
JP2002349167A
Publication Date:
July 02, 2004
Filing Date:
November 29, 2002
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
C08F16/24; C08F20/22; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): C08F20/22; C08F16/24; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Hiroaki Sakai