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Patent Searching and Data


Title:
POLYMER COMPOUND, RESIST MATERIAL, AND METHOD FOR FORMING PATTERN
Document Type and Number:
Japanese Patent JP2005126692
Kind Code:
A
Abstract:

To provide a resist material having excellent transmittance to exposure light having a wavelength zone of not more than 300 nm, and further having excellent adhesion to a substrate and solubility in a developing solution.

This resist material contains a base resin, wherein the base resin comprises a polymer compound which contains first units each having a sulfonamide group and expressed by formula and second units each having a condensed ring.


Inventors:
Kishimura, Shinji
Endo, Masataka
Sasako, Masaru
Ueda, Mitsuru
Iimori, Hirokazu
Fukuhara, Toshiaki
Application Number:
JP2004000278183
Publication Date:
May 19, 2005
Filing Date:
September 24, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G03F7/039; C08F228/02; C08F232/08; H01L21/027; (IPC1-7): C08F228/02; C08F232/08; G03F7/039; H01L21/027
Attorney, Agent or Firm:
前田 弘
小山 廣毅
竹内 宏
嶋田 高久
竹内 祐二
今江 克実
藤田 篤史
二宮 克也
原田 智雄
井関 勝守