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Patent Searching and Data


Title:
POLYMER COMPOUND, RESIST MATERIAL, AND PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP2002234915
Kind Code:
A
Abstract:

To provide a polymer compound which, when used as a base resin, gives a resist material which is sensitive to high-energy rays and excellent in sensitivity, resolution, and etching resistance.

This polymer compound contains repeating units represented by formula (1) and/or (2) (wherein R1 and R2 are each H or an alkyl, acyl, alkylsulfonyl, alkoxycarbonyl or alkoxyalkyl group; R3 and R4 are each H or an alkyl, alkoxy or alkoxyalkyl group provided that R3, R4, and the carbon atoms to which they are bonded may combine with each other to form a 4-8C aliphatic ring and that R3 together with R4 may be one oxygen atom; and k is 0 or 1).


Inventors:
NISHI TSUNEHIRO
KANOU TAKESHI
Application Number:
JP2001369711A
Publication Date:
August 23, 2002
Filing Date:
December 04, 2001
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
G03F7/039; C08F34/02; C08F220/12; C08F222/06; C08F222/40; C08F232/00; C08F234/02; H01L21/027; (IPC1-7): C08F34/02; C08F220/12; C08F222/06; C08F222/40; C08F232/00; C08F234/02; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Takashi Kojima (1 person outside)