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Patent Searching and Data


Title:
POLYMER COMPOUND, RESIST MATERIAL, AND PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP2002338633
Kind Code:
A
Abstract:

To provide a polymer compound which is sensitive to a high-energy ray, is excellent in sensitivity, resolution, and etching resistance, and hence is useful for fine processing using an electron beam or ultraviolet rays.

This polymer compound has a wt. average mol.wt. of 1,000-500,000 and contains repeating units represented by formulas (1) and (2) [W is a 2-15C divalent group and forms, together with the carbon atom to which W is bonded, a 5- or 6-membered cyclic ketone, lactone, cyclic carbonate, cyclic acid anhydride, or cyclic imide; Y is O or NR1 (R1 is H or a 1-15C linear, branched or cyclic alkyl group); and k is 0 or 1] and at least one kind of unit decomposable under acidic conditions to generate a carboxylic acid.


Inventors:
NISHI TSUNEHIRO
KOBAYASHI TOMOHIRO
Application Number:
JP2001150535A
Publication Date:
November 27, 2002
Filing Date:
May 21, 2001
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08F220/10; C08F222/06; C08F222/10; C08F222/40; C08F232/08; G03F7/004; H01L21/027; G03F7/039; (IPC1-7): C08F222/06; C08F220/10; C08F222/10; C08F222/40; C08F232/08; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Takashi Kojima (1 person outside)