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Title:
POLYMER COMPOUND, RESIST MATERIAL, AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2005240024
Kind Code:
A
Abstract:

To provide a resist material excellent in the transmissivity of far ultraviolet rays with a wavelength of 300 nm or below, especially ArF (193 nm), especially a novel polymer compound useful as the base polymer of a chemically amplified resist material, a resist material containing the same and, a pattern forming method using the same.

The subject polymer compound is constituted of repeating units represented by formulae (1a) (1b) and (1c) (wherein R1, R2, R5 and R6 are each H or F, R3 and R7 are each F or a fluorinated alkyl group, R4 is an acid unstable group, R8 is an adhesion group, R9a, R9b, R9c and R9d are each H or an alkyl group being an adhesion group, at least two of R9a-R9d may be bonded to form a ring but all of R9a-R9d are not hydrogen atom at the same time, R10 is methylene group, a polymeric compound, oxygen atom or sulfur atom and (d) is 0 or 1).


Inventors:
Hatakeyama, Jun
Harada, Yuji
Kawai, Yoshio
Sasako, Masaru
Endo, Masataka
Kishimura, Shinji
Maeda, Kazuhiko
Komoriya, Haruhiko
Yamanaka, Kazuhiro
Application Number:
JP2005000015496
Publication Date:
September 08, 2005
Filing Date:
January 24, 2005
Export Citation:
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Assignee:
SHIN ETSU CHEM CO LTD
MATSUSHITA ELECTRIC IND CO LTD
CENTRAL GLASS CO LTD
International Classes:
G03F7/004; C08F20/22; C08F212/14; C08F220/10; C08F224/00; C08F232/08; C08F234/00; G03C1/76; G03F7/038; G03F7/039; H01L21/027; (IPC1-7): C08F220/10; C08F212/14; C08F224/00; C08F232/08; C08F234/00; G03F7/004; G03F7/038; H01L21/027
Domestic Patent References:
JP2003192733A2003-07-09
JP2001302728A2001-10-31
JP2003226689A2003-08-12
JP2001233917A2001-08-28
JP2002234916A2002-08-23
Attorney, Agent or Firm:
小島 隆司
重松 沙織
小林 克成
石川 武史