Title:
POLYMER COMPOUND, RESIST MATERIAL AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP3874094
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resist material which is sensitive to high-energy radiation and excellent in sensitivity to rays of a wavelength of 200 nm or shorter, particularly 170 nm or shorter.
SOLUTION: This resist material comprises a polymer compound having repeating units represented by formulas (1m) and (1n) [wherein R1 is F or a fluorinated alkyl; R2 is an acid-unstable group; R3 is methylene, ethylene, O or S; R4 is (CH2)aCO2R5 or (CH2)aC(R6)2(OR7) (wherein R5 and R7 are each an acid-unstable group, an adherent group, H, an alkyl or a fluorinated alkyl; R6 is H, F, an alkyl or a fluorinated alkyl, containing at least one fluorine atom; and a is 0 to 6); and 0<m<1, and 0<n<1, provided that 0<m+n≤1].
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Inventors:
Jun Hatakeyama
Yuji Harada
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Mitsutaka Otani
Haruhiko Komoriya
Yuji Harada
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Mitsutaka Otani
Haruhiko Komoriya
Application Number:
JP2001393359A
Publication Date:
January 31, 2007
Filing Date:
December 26, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
International Classes:
C08F220/22; G03F7/039; C08F232/00; C08F234/00; H01L21/027; (IPC1-7): C08F220/22; C08F232/00; C08F234/00; G03F7/039; H01L21/027
Domestic Patent References:
JP2001233917A |
Foreign References:
WO2000017712A1 |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa