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Title:
POLYMER COMPOUND, RESIST MATERIAL, AND PROCESS FOR FORMING PATTERN
Document Type and Number:
Japanese Patent JP3874093
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a resist material which is sensitive to high-energy rays and is excellent in the sensitivity at a wave length of 200 nm or less, especially of 170 nm or less.
SOLUTION: The polymer compound contains repeating units expressed by formulae (1m), (1n) and (1p) (wherein R1 and R2 are each H, F, an alkyl group, or a fluorinated alkyl group, R3 is F or a fluorinated alkyl group; R4 is an acid unstable group; R5a, R5b, R6a and R6b are each H, OH an alkyl group, a fluorinated alkyl group, (CH2)dCO2R7 or (CH2)dC(R8)2(OR7), but R7 is an acid unstable group, a tightly conjunctioning group, a hydrogen atom, an alkyl group, or a fluorinated alkyl group, and R8 is H, F, an alkyl group, or a fluorinated alkyl group; 0≤m<1, 0<n<1, 0≤p<1, 0<m+n+p≤1, but m and p are not 0 at the same time; c is 0 or 1; d is 0 through 6; X is a methylene group, an ethylene group, an oxygen atom or a sulfur atom).


Inventors:
Jun Hatakeyama
Yuji Harada
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Mitsutaka Otani
Haruhiko Komoriya
Application Number:
JP2001393354A
Publication Date:
January 31, 2007
Filing Date:
December 26, 2001
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
International Classes:
C08F220/18; G03F7/039; C08F216/02; C08F232/08; C08F234/00; H01L21/027; (IPC1-7): C08F220/18; C08F216/02; C08F232/08; C08F234/00; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa