Title:
ポリマーデバイスおよび作製方法
Document Type and Number:
Japanese Patent JP7042514
Kind Code:
B2
Abstract:
Some polymeric devices, as described herein, can be made of a first layer and a second layer bonded together with one or more microfluidic channels defined internal to the device. The first layer and the second layer may each include a substrate and a polymer bonded to the substrate. The two layers may be bonded through a polymer network that interpenetrates the polymers in the first and second layers. This disclosure also describes methods of bonding together polymeric articles. The methods include diffusing polymerizable monomers and radical forming initiators into the surfaces of one or both of the polymers, putting the surfaces into contact, and initiating polymerization to create a polymer network that interpenetrates the polymers.
More Like This:
WO/1996/007535 | METHOD FOR JOINING PLASTIC MOLDINGS |
JPS5587536 | SPLICING OF WATERPROOF SHEET |
Inventors:
Bread Tin Louis
Cohen Edward Aaron
Buzzle Ben
Yang Gaomai
Cohen Edward Aaron
Buzzle Ben
Yang Gaomai
Application Number:
JP2019506372A
Publication Date:
March 28, 2022
Filing Date:
August 03, 2017
Export Citation:
Assignee:
Micro Optics Incorporated
International Classes:
B29C65/48; B29C33/40; C08F265/06; C08F291/00
Domestic Patent References:
JP2011504960A | ||||
JP2007527784A |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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