Title:
接着性の改善されたポリマー微粒子含有硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6476045
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in adhesion.SOLUTION: The curable resin composition contains, based on 100 pts.mass of an epoxy resin (A), 1-100 pts.mass of polymer fine particles (B) having a core-shell structure in which a core layer is a diene rubber. The core layer of the component (B) is the diene rubber obtained by polymerizing a monomer mixture comprising (b1) 50-99.99 mass% of a conjugated diene monomer, (b2) 49.99-0 mass% of a vinyl monomer copolymerizable with the conjugated diene monomer, and (b3) 0.01-3 mass% of a chain transfer agent. A first curable resin composition (I) further contains 1-100 pts.mass of at least one (C) selected from the group consisting of a blocked urethane, a rubber-modified epoxy resin, and an urethane-modified epoxy resin. A second curable resin composition (II) further contains 4.5-6.5 pts.mass of dicyandiamide as an epoxy curing agent (D).SELECTED DRAWING: None
Inventors:
Toshihiko Okamoto
Application Number:
JP2015080396A
Publication Date:
February 27, 2019
Filing Date:
April 09, 2015
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L63/00; C08F2/38; C08F279/02; C08G59/40; C08L51/04; C08L75/04; C09J11/06; C09J11/08; C09J163/00; C09J175/04
Domestic Patent References:
| JP2003119339A | ||||
| JP2005255822A | ||||
| JP8100162A |
Foreign References:
| WO2004108825A1 | ||||
| WO2006019041A1 | ||||
| WO2013118697A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark