POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC DEVICE

Title:

POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC DEVICE

Document Type and Number:

Japanese Patent JP2018115337

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a novel polymer capable of improving reliability of a material used in a manufacturing process of an electronic device.SOLUTION: The polymer contains a structural unit represented by formula (1a), a structural unit represented by formula (1b), and a structural unit represented by formula (1c). (In the formula (1a), n is 0, 1 or 2, and R, R, Rand Rare each independently hydrogen or a C1-10 organic group. In the formula (1c), Ris a C1-10 organic group.)SELECTED DRAWING: Figure 1

Inventors:

ONISHI OSAMU
IKEDA TAKAO
LARRY RHODES
KANDANARACHCHI PRAMOD
HUGH BURGOON

Application Number:

JP2018062816A

Publication Date:

July 26, 2018

Filing Date:

March 28, 2018

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO
PROMERUS LLC

International Classes:

C08F232/08; C08F232/04; G03F7/023

Domestic Patent References:

JP2015064576A

2015-04-09

Attorney, Agent or Firm:

Shinji Hayami

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