Title:
POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2017025223
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polymer that gives a resin film having high transparency and showing an excellent balance in high dimensional accuracy of patterning and chemical resistance, and a photosensitive resin composition, a resin film and an electronic apparatus using the polymer.SOLUTION: The polymer is obtained by radical polymerization of a monomer (A) comprising a norbornene derivative having hydrogen or an organic group having 1 to 10 carbon atoms represented by formula (1), and a monomer (B) containing a (meth)acryl group and a glycidyl group or an oxetane group in the molecule.SELECTED DRAWING: None
Inventors:
IKEDA TAKAO
Application Number:
JP2015146148A
Publication Date:
February 02, 2017
Filing Date:
July 23, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F232/08; C08F220/28; C08F220/32; C08F222/40; G03F7/023; G03F7/20; G03F7/40
Domestic Patent References:
| JP2013242540A | 2013-12-05 | |||
| JP2001343748A | 2001-12-14 |
Attorney, Agent or Firm:
Shinji Hayami