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Title:
POLYMER AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2018188654
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polymer which is used for forming a permanent film and is capable of suppressing the occurrence of an undercut in a patterning step, and to provide a photosensitive resin composition containing the same.SOLUTION: The polymer contains structural units represented by formulae (1a) and (1b). (In the formula (1a), n is 0-2, and R-Rare each independently hydrogen or a C1-10 organic group, provided that at least one of them is an organic group containing a carboxyl group, an epoxy ring or an oxetane ring. In the formula (1b), m is 0-2, and R-Rare each independently hydrogen or a C1-10 organic group, provided that at least one of them is an alkoxysilyl group.)SELECTED DRAWING: Figure 1

Inventors:
大西 治
Application Number:
JP2018134682A
Publication Date:
November 29, 2018
Filing Date:
July 18, 2018
Export Citation:
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Assignee:
住友ベークライト株式会社
International Classes:
C08F232/00; C08F222/40; C08G59/02; G03F7/023; G03F7/032
Attorney, Agent or Firm:
速水 進治