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Patent Searching and Data


Title:
ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法
Document Type and Number:
Japanese Patent JP4163756
Kind Code:
B2
Abstract:
An innovative method of manufacturing polishing pads using photocuring polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.

Inventors:
Cook Lee Melbourne
James David Bee.
Chetic energy.
Badinger William Dee.
Application Number:
JP53109098A
Publication Date:
October 08, 2008
Filing Date:
January 12, 1998
Export Citation:
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Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
B24B37/22; B24B37/26; B24D3/00; B24D11/00; B24D18/00; H01L21/304
Domestic Patent References:
JP6179166A
JP56121565U
JP3202281A
JP7502461A
JP1036808A
JP373276A
JP8511210A
JP8510694A
Foreign References:
US4456500
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda