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Title:
POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2017057260
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polymer that, if it is formed into a photosensitive resin composition, improves the heat resistance of a resin film.SOLUTION: A polymer comprises a monomer represented by formula (1), and a repeating unit derived from maleic anhydride and half ester of maleic anhydride (one or more of R-Ris a cyclic ether-containing group; the others are H or a C1-30 organic group; n is an integer of 0-2).SELECTED DRAWING: None

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Inventors:
ONISHI OSAMU
Application Number:
JP2015182093A
Publication Date:
March 23, 2017
Filing Date:
September 15, 2015
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F232/08; C08F8/14; C08F222/06; C08F222/16; C08F222/20; C08F222/26; C08F290/12; C08G59/40; C08G65/18; G03F7/004; G03F7/023; G03F7/038; G03F7/20
Domestic Patent References:
JP2001343748A2001-12-14
JP2015007762A2015-01-15
JP2014137426A2014-07-28
JP2015064576A2015-04-09
JP2015007770A2015-01-15
JP2015182957A2015-10-22
Foreign References:
WO2016175103A12016-11-03
Attorney, Agent or Firm:
Shinji Hayami



 
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