POLYMER, RESIN COMPOSITION AND RESIN FILM

Title:

POLYMER, RESIN COMPOSITION AND RESIN FILM

Document Type and Number:

Japanese Patent JP2020070340

Kind Code:

A

Abstract:

To provide a polymer excellent in heat resistance, and capable of obtaining a resin film with fewer cracks when the resin film is formed with a resin composition containing the polymer.SOLUTION: A polymer includes a structural unit expressed by a formula (SC), a structural unit (A) derived from a cyclic olefin and a structural unit expressed by a formula (B), in a molecule. A weight average molecular weight Mw of the polymer is 25,000 or more. If a solution obtained by dissolving 2 g of the polymer in 8 g of methyl amyl ketone (MAK) is filtrated by a filter having a pore size of 5.0 μm, a filtration residue is 1 g or less.SELECTED DRAWING: None

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Inventors:

IMAI KEITA

Application Number:

JP2018204943A

Publication Date:

May 07, 2020

Filing Date:

October 31, 2018

Export Citation:

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