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Patent Searching and Data


Title:
POLYMER FOR RESIST
Document Type and Number:
Japanese Patent JP2005239903
Kind Code:
A
Abstract:

To obtain a polymer for a resist, having small line edge roughness and slightly forming microgel and defects when used as a resist resin in DUV excimer laser lithography, electron beam lithography, etc., and a resist composition and to provide a method for pattern production using the resist composition.

The polymer for a resist comprises at least one kind of a constituent unit selected from the group consisting of constituent units represented by formula (1) and formula (1b) (R2 and R3 are each a hydrogen atom or a 1-6C alkyl group; n1 is 1 or 2) and a fluorine-containing constituent unit.


Inventors:
Otake, Atsushi
Momose, Akira
Application Number:
JP2004000052387
Publication Date:
September 08, 2005
Filing Date:
February 26, 2004
Export Citation:
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Assignee:
MITSUBISHI RAYON CO LTD
International Classes:
G03F7/039; C08F220/34; C08F232/00; H01L21/027; (IPC1-7): C08F220/34; C08F232/00; G03F7/039; H01L21/027