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Title:
POLYMERIC COMPOUND, PHOTORESIST COMPOSITION CONTAINING IT AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2005325325
Kind Code:
A
Abstract:

To provide a polymeric compound the alkali solubility of which changes in a large way before and after exposure in a chemically amplified positive resist, a photoresist composition containing the polymeric compound and capable of forming a precise pattern of high resolution, and a method for forming a resist pattern.

This polymeric compound has an alkali soluble group (i). The alkali soluble group (i) is one selected from an alcoholic hydroxyl group, a carboxyl group or a phenolic group that have a substituent protected by an acid dissociative dissolution inhibiting group (ii) represented by general formula (1), wherein R represents a ≤20C organic group of ≥n valency and n represents an integer of 2-5. The photoresist composition and the method for forming the resist pattern are performed using the polymeric compound.


Inventors:
Ogata, Toshiyuki
Yoshida, Masaaki
Haneda, Hideo
Matsumaru, Shogo
Application Number:
JP2004000181068
Publication Date:
November 24, 2005
Filing Date:
June 18, 2004
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/032; C08F8/00; C08F212/14; C08F220/28; C08F232/02; G03F7/039; H01L21/027; (IPC1-7): C08F8/00; C08F212/14; C08F220/28; C08F232/02; G03F7/032; G03F7/039; H01L21/027
Domestic Patent References:
JPH08305025A1996-11-22
JPH1031310A1998-02-03
JP2002062656A2002-02-28
JP2002169292A2002-06-14
JP2003233177A2003-08-22
JPS595241A1984-01-12
JPH02289607A1990-11-29
JP2002244299A2002-08-30
Attorney, Agent or Firm:
棚井 澄雄
志賀 正武
青山 正和
鈴木 三義
柳井 則子