Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYMERIC MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2007332271
Kind Code:
A
Abstract:

To provide a polymeric molded product as a container with antistaticity/dust deposition proofness through improving the electrical conductivity of a polymeric material as a material of e.g. the container for semiconductor wafers or the like.

The container is made by incorporating the polymeric material with electrically conductive nanotube such as carbon nanotube followed by injection molding. In this container, the polymeric material constituting the container, when the ratio L/t( wherein, L is the length between the gate and the container's end, and the representative thickness of the container ) is increased, or in the case of a sheet-like product, when the sheet thickness ratio t1/t0before and after its rolling/orientation is decreased, the electrical conductivity tends to increase; particularly, when the ratio L/t is 50 or greater, or the ratio t1/t0is 0.7 or less, this tendency is noticeable. This is because the electrically conductive nanotube in the polymeric material's matrix is aligned in its longitudinal direction. The container for semiconductor wafers or the like molded using the above polymeric material is antistatic, therefore being free of dust deposition or the like, thus being applicable to semiconductor's microfabrication process.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
KASAMA NOBUYUKI
Application Number:
JP2006165656A
Publication Date:
December 27, 2007
Filing Date:
June 15, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MIRAIAL KK
International Classes:
C08J5/18; B29C45/17; B29C55/02; B65D1/00; B65D85/86; B82B1/00; B82Y10/00; B82Y30/00; B82Y40/00; C08K3/00; C08L101/00; G03F1/40; G03F1/66; H01L21/027; H01L21/673
Domestic Patent References:
JP2001281965A2001-10-10
JP2004134515A2004-04-30
JP2006100712A2006-04-13
JPH0257401A1990-02-27